BEOL应力对BiCMOS9MW HBTs的影响

E. Canderle, P. Chevalier, G. Avenier, N. Derrier, D. Céli, C. Gaquière
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引用次数: 8

摘要

对意法半导体BiCMOS9MW技术的SiGe HBTs进行了应力研究。金属连接叠加产生的应变影响了晶体管的基带隙:从密度更大的假体结构的参考中,指出了9.1 meV的带隙能量变化。在直流和高频特性中嵌入假体结构,集电极电流增加25%,传输频率fT和fMAX分别增加21%和12%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Impact of BEOL stress on BiCMOS9MW HBTs
Stress investigations have been carried out on SiGe HBTs from STMicroelectronics BiCMOS9MW technology. The strain created by the stack of metal connections impacts the base bandgap of the transistors: from the reference to the denser dummies structure, a 9.1 meV bandgap energy variation is pointed out. Dummies structures were embedded for both DC and HF characterizations which showed a 25% increase for the collector current, and a 21% and 12% increase for the transit frequencies fT and fMAX respectively.
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