采用无源基板容错技术提高多芯片模块良率

1996 Proceedings. Eighth Annual IEEE International Conference on Innovative Systems in Silicon Pub Date : 1996-10-09 DOI:10.1109/ICISS.1996.552427

C. Peacock, H. Bolouri, C. Habiger

{"title":"采用无源基板容错技术提高多芯片模块良率","authors":"C. Peacock, H. Bolouri, C. Habiger","doi":"10.1109/ICISS.1996.552427","DOIUrl":null,"url":null,"abstract":"The widespread use of multichip module (MCM) technology is currently restricted by high substrate cost, poor substrate yield and low quality level of mounted components: the known good die (KGD) problem. This paper examines three yield enhancing fault tolerance techniques suitable for use with conventional (passive) substrates with the aid of a generic processor-memory MCM architecture. The use of spare memory dies and a paged address space is shown to be a very effective solution to the KGD problem for this particular architecture.","PeriodicalId":131620,"journal":{"name":"1996 Proceedings. Eighth Annual IEEE International Conference on Innovative Systems in Silicon","volume":"66 7","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Multichip module yield enhancement using passive substrate fault tolerance\",\"authors\":\"C. Peacock, H. Bolouri, C. Habiger\",\"doi\":\"10.1109/ICISS.1996.552427\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The widespread use of multichip module (MCM) technology is currently restricted by high substrate cost, poor substrate yield and low quality level of mounted components: the known good die (KGD) problem. This paper examines three yield enhancing fault tolerance techniques suitable for use with conventional (passive) substrates with the aid of a generic processor-memory MCM architecture. The use of spare memory dies and a paged address space is shown to be a very effective solution to the KGD problem for this particular architecture.\",\"PeriodicalId\":131620,\"journal\":{\"name\":\"1996 Proceedings. Eighth Annual IEEE International Conference on Innovative Systems in Silicon\",\"volume\":\"66 7\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-10-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1996 Proceedings. Eighth Annual IEEE International Conference on Innovative Systems in Silicon\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICISS.1996.552427\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1996 Proceedings. Eighth Annual IEEE International Conference on Innovative Systems in Silicon","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICISS.1996.552427","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

多芯片模块(MCM)技术的广泛应用目前受到高衬底成本，衬底成品率差和安装组件质量水平低的限制:已知的好模具(KGD)问题。本文在通用处理器-存储器MCM架构的帮助下，研究了适用于传统(被动)衬底的三种良率增强容错技术。对于这种特殊的体系结构，使用空闲内存和分页地址空间是解决KGD问题的一种非常有效的方法。

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Multichip module yield enhancement using passive substrate fault tolerance

The widespread use of multichip module (MCM) technology is currently restricted by high substrate cost, poor substrate yield and low quality level of mounted components: the known good die (KGD) problem. This paper examines three yield enhancing fault tolerance techniques suitable for use with conventional (passive) substrates with the aid of a generic processor-memory MCM architecture. The use of spare memory dies and a paged address space is shown to be a very effective solution to the KGD problem for this particular architecture.

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1996 Proceedings. Eighth Annual IEEE International Conference on Innovative Systems in Silicon

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