粘接接头界面和层间裂纹的混合模式断裂韧性表征

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458) Pub Date : 2000-11-30 DOI:10.1109/EMAP.2000.904154

H. Pang, S.N. Bong, X. Shi, Z. Wang

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引用次数: 6

摘要

采用基于断裂力学的方法对胶结破坏进行了评估。研究了两种类型的断裂试样。采用巴西坚果夹心(BNS)试样和致密混合模式(CMM)试样测定粘接接头的断裂韧性。研究了界面裂纹和层间裂纹试样的断裂韧性测量。建立了粘结接头界面或层间裂纹的混合模式断裂准则。结果表明:II型断裂韧性普遍大于I型断裂韧性;在CMM试样中，界面裂纹特征的断裂韧性低于内聚层间裂纹破坏的断裂韧性。生成了层间和界面裂纹形态的失效分析图。

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Mixed mode fracture toughness characterization for interface and interlayer cracks in adhesive bonded joints

An approach based on fracture mechanics was employed to assess adhesive bond failure. Two types of fracture specimens were investigated. The Brazil nut sandwich (BNS) specimen and the compact mixed mode (CMM) specimen were used to determined the fracture toughness of adhesive joints. Fracture toughness measurements for interface crack and interlayer crack specimens were investigated. Mixed mode fracture criteria for interface or interlayer cracks in adhesive bonded joints were developed. The results showed that the mode II fracture toughness generally displayed a larger value than the mode I toughness. In the case of the CMM specimen, fracture toughness for interface crack feature toughness is lower than that for a cohesive interlayer crack failure. Failure analysis diagrams were generated for both interlayer and interface crack configurations.

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International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458)

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