自组装单层(SAM)在银纳米颗粒导电纳米复合材料中的作用

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Pub Date : 2005-03-16 DOI:10.1109/ISAPM.2005.1432087

Hongjin Jiang, K. Moon, Lingbo Zhu, Jiongxin Lu, C. Wong

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引用次数: 5

摘要

为了提高各向同性导电胶粘剂(ICA)的电学性能，采用自组装单层(SAM)化合物促进银纳米粒子在环氧树脂中的分散。为了增加银纳米粒子在环氧树脂中的填充量，首先对银纳米粒子进行了SAM处理。用差示扫描量热仪(DSC)研究了银与SAM之间的键合和热脱键行为。采用热重分析(TGA)方法测定了Ag纳米颗粒上包裹的SAM的量。采用扫描电子显微镜(SEM)研究了经过SAM处理的Ag纳米颗粒热处理前后的形貌。以经sam处理的银纳米颗粒为导电填料，制备了几种环氧树脂配方，并对其电阻率进行了研究。

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The role of self-assembled monolayer (SAM) on Ag nanoparticles for conductive nanocomposite

To improve the electrical property of the isotropic conductive adhesives (ICA), self-assembled monolayer (SAM) compounds were used to help the dispersion of silver nanoparticles in epoxy resin. Silver nanoparticles were first treated by the SAM in order to increase the filler loading of nanoparticles in epoxy resin. The bonding and thermal debonding behavior between silver and SAM was investigated by differential scanning calorimeter (DSC). The amount of SAM coated on Ag nanoparticles was tested by thermogravimetric analysis (TGA). Scanning electron microscopy (SEM) was used to study the morphologies of SAM treated Ag nanoparticles before and after the heat treatment. Several kinds of epoxy formulation were prepared by using SAM-treated Ag nanoparticles as conductive fillers and the resistivities were studied.

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Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.

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