S. Fujino, Yuta Mizuno, K. Takaoka, M. Mori, K. Maezawa
{"title":"用于高性能数字超声传感器的InP基板MEMS麦克风","authors":"S. Fujino, Yuta Mizuno, K. Takaoka, M. Mori, K. Maezawa","doi":"10.1109/IMFEDK.2013.6602256","DOIUrl":null,"url":null,"abstract":"This paper describes the fabrication process of the MEMS microphones on InP substrates. The process is based on ozone ashing of the photoresist to fabricate a hollow structure. This process was demonstrated to be damage-free, and suitable for integration with HEMTs.","PeriodicalId":434595,"journal":{"name":"2013 IEEE International Meeting for Future of Electron Devices, Kansai","volume":"36 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-06-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"MEMS microphones on InP substrates for high performance digital ultrasonic sensors\",\"authors\":\"S. Fujino, Yuta Mizuno, K. Takaoka, M. Mori, K. Maezawa\",\"doi\":\"10.1109/IMFEDK.2013.6602256\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes the fabrication process of the MEMS microphones on InP substrates. The process is based on ozone ashing of the photoresist to fabricate a hollow structure. This process was demonstrated to be damage-free, and suitable for integration with HEMTs.\",\"PeriodicalId\":434595,\"journal\":{\"name\":\"2013 IEEE International Meeting for Future of Electron Devices, Kansai\",\"volume\":\"36 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2013-06-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2013 IEEE International Meeting for Future of Electron Devices, Kansai\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IMFEDK.2013.6602256\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE International Meeting for Future of Electron Devices, Kansai","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMFEDK.2013.6602256","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
MEMS microphones on InP substrates for high performance digital ultrasonic sensors
This paper describes the fabrication process of the MEMS microphones on InP substrates. The process is based on ozone ashing of the photoresist to fabricate a hollow structure. This process was demonstrated to be damage-free, and suitable for integration with HEMTs.