硅传声器系统的建模与应用

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI:10.1109/EPTC.2004.1396600

H-T. Mammen, U. Sturmer, M. Koch, H. Kohne, K. Becker, W. John, H. Reichl

{"title":"硅传声器系统的建模与应用","authors":"H-T. Mammen, U. Sturmer, M. Koch, H. Kohne, K. Becker, W. John, H. Reichl","doi":"10.1109/EPTC.2004.1396600","DOIUrl":null,"url":null,"abstract":"The modelling procedure described in this publication which is based on a partitioning of the total structure, allows a synthesis of the overall transfer function from simple, physics-motivated equations representing the behaviour of the substructures. Casting this into a Matlab description admits relatively easy combination with a GUI in order to obtain a modelling environment convenient for parameter studies during the development process. In parallel, some package solution for single-chip and array microphones are developed. During the model development it is not possible to consider all kinds of applications taking into account, so that some effects occur first at the finished product. Especially in a car application (handsfree set) for mobile phones occurred parasitic EMC effects. Based on this example, the EMC problems are described and solutions for circuit- as well as for package-level are presented.","PeriodicalId":370907,"journal":{"name":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Modelling and application of silicon microphone systems\",\"authors\":\"H-T. Mammen, U. Sturmer, M. Koch, H. Kohne, K. Becker, W. John, H. Reichl\",\"doi\":\"10.1109/EPTC.2004.1396600\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The modelling procedure described in this publication which is based on a partitioning of the total structure, allows a synthesis of the overall transfer function from simple, physics-motivated equations representing the behaviour of the substructures. Casting this into a Matlab description admits relatively easy combination with a GUI in order to obtain a modelling environment convenient for parameter studies during the development process. In parallel, some package solution for single-chip and array microphones are developed. During the model development it is not possible to consider all kinds of applications taking into account, so that some effects occur first at the finished product. Especially in a car application (handsfree set) for mobile phones occurred parasitic EMC effects. Based on this example, the EMC problems are described and solutions for circuit- as well as for package-level are presented.\",\"PeriodicalId\":370907,\"journal\":{\"name\":\"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)\",\"volume\":\"36 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-12-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2004.1396600\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2004.1396600","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

本出版物中描述的建模过程基于总结构的划分，允许从代表子结构行为的简单物理驱动方程中综合整体传递函数。将其转换为Matlab描述可以相对容易地与GUI相结合，以便在开发过程中获得方便进行参数研究的建模环境。同时，提出了单片机和阵列麦克风的封装方案。在模型开发期间，不可能考虑到所有类型的应用程序，因此一些影响首先出现在成品中。特别是在车载应用(免提装置)中对手机产生寄生EMC效应。在此基础上，阐述了电路级和封装级的电磁兼容问题，并提出了解决方案。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Modelling and application of silicon microphone systems

The modelling procedure described in this publication which is based on a partitioning of the total structure, allows a synthesis of the overall transfer function from simple, physics-motivated equations representing the behaviour of the substructures. Casting this into a Matlab description admits relatively easy combination with a GUI in order to obtain a modelling environment convenient for parameter studies during the development process. In parallel, some package solution for single-chip and array microphones are developed. During the model development it is not possible to consider all kinds of applications taking into account, so that some effects occur first at the finished product. Especially in a car application (handsfree set) for mobile phones occurred parasitic EMC effects. Based on this example, the EMC problems are described and solutions for circuit- as well as for package-level are presented.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)

自引率

0.00%

发文量