通过建筑学研究未登陆地区的新方法。应用于高级互连:低k铝和铜双大马士革

Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) Pub Date : 1900-01-01 DOI:10.1109/IITC.2000.854286

P. Gayet, C. Lair, E. van den Vegt

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摘要

本文介绍了一种用于研究无着陆过孔的新型试验结构。显示了传统链表征通孔的局限性。新结构使我们能够使用HSQ和铝互连以0.18 /spl mu/m的技术提高产品良率。最后，强调比较不同的铜双大马士革结构是非常有用的。

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New method to study unlanded via architecture. Application to advanced interconnects: Al with low k and copper dual damascene

This paper describes a new test structure developed to study unlanded vias. The limitation of conventional chains to characterize vias is shown. The new structures enabled us to improve product yield in a 0.18 /spl mu/m technology using HSQ and aluminum interconnects. Finally, it is emphasized that it is very useful to compare different copper dual damascene architectures.

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Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407)

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