iProbe-d:热载流子和氧化物可靠性模拟器

Ping-Chung Li, G. Stamoulis, I. Hajj
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引用次数: 17

摘要

本文介绍了一种热载流子和氧化物可靠性模拟器iProbe-d。在本程序中,采用概率时序方法来寻找在预期工作条件下CMOS VLSI数字电路设计中最容易受到热载流子退化和/或氧化物击穿的器件。在确定每个器件的损坏后,结合损坏晶体管模型、RC延迟和关键路径分析来估计热载子效应(HCE)对电路性能的影响;即电路延迟的增加。研究结果可用于在制造前提高电路的可靠性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
iProbe-d: a hot-carrier and oxide reliability simulator
In this paper we describe a hot-carrier and oxide reliability simulator, iProbe-d. In this program, a probabilistic timing approach is employed to find the most susceptible devices to hot-carrier degradation and/or oxide breakdown in a CMOS VLSI digital circuit design under expected operating conditions. After the damage in each device is determined, a combination of damaged-transistor model, RC delay and critical path analysis is used to estimate the impact of hot-carrier effects (HCE) on circuit performance; namely, the increase of circuit delay. The results can then be used to improve the reliability of the circuit prior to fabrication.<>
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