封装工程中的小信号电气测试

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) Pub Date : 2010-11-01 DOI:10.1109/IEMT.2010.5746762

C. S. Liu

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引用次数: 1

摘要

主讲人将深入介绍当今的IC测试系统和测试处理程序及其面临的挑战和选择。关键测试模块(功能测试或参数测试)和关键测试功能将被检查和说明。将详细讨论关于测试程序、控制和包装资格限制的有趣案例研究，包括一些应对未来包装测试挑战的技巧。

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Small signal electrical testing in package engineering

The keynote speaker will provide an insight into today IC test systems and test handlers and their challenges and selection. The key test blocks (functional test or parametric) and key test functions will be examined and illustrated. Interesting case studies on test program and control and limitation for packaging qualification will be discussed in detail including some tips to meet future packaging test challenges.

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2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)

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