高k /金属栅极堆的递进击穿特性

G. Bersuker, N. Chowdhury, C. Young, D. Heh, D. Misra, R. Choi
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引用次数: 32

摘要

研究了高频基高k介电材料在宽厚度范围内的击穿特性,确定了栅极叠层中的“薄弱环节”及其在反转应力作用下的主要击穿机制。应力泄漏电流的增长速率、矽密度和界面陷阱密度之间的相关性表明,击穿是由界面SiO2层中产生的陷阱触发的。从SILC数据中获得的差电阻的应力-时间演变及其斜率允许识别高k/金属栅堆的渐进击穿
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Progressive Breakdown Characteristics of High-K/Metal Gate Stacks
Breakdown characteristics of Hf-based high-k dielectrics in a wide thickness range were investigated to identify the "weak link" in the gate stack and its leading breakdown mechanisms under inversion stress. A strong correlation among the growth rates of the stress leakage current, SILC, and interface trap density suggests that breakdown is triggered by trap generation in the interfacial SiO2 layer. Stress-time evolution of the differential resistance and its slope obtained from SILC data allows progressive breakdown in high-k/metal gate stacks to be identified
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