2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual

2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual
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2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual - 最新文献

A Study on Wire Ball/Pad Open Failure Mechanism of a Multi-Stack Package (MSP) under High Temperature Storage (HTS) Condition

Pub Date : 2007-04-15 DOI: 10.1109/RELPHY.2007.369878 S. Yang, Hyeong-Jik Byun, Sangwook Park, Wang-joo Lee

Cu Interconnect Width Effect, Mechanism and Resolution on Down-Stream Stress Electromigration

Pub Date : 2007-04-01 DOI: 10.1109/RELPHY.2007.369881 Yi-Lung Cheng, B. Lin, S.Y. Lee, C. Chiu, K. Wu

Kinetic Analysis of X-Ray Irradiation Induced Static Refresh Failure Mechanism in DRAM

Pub Date : 2007-04-01 DOI: 10.1109/RELPHY.2007.369871 A. Ditali, M. Ma, B. Black, Shi-Jie Wen, S. Chung
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