附加物质软断层临界区提取

Proceedings of International Workshop on Defect and Fault Tolerance in VLSI Pub Date : 1995-11-13 DOI:10.1109/DFTVS.1995.476937

G. A. Allan, A. Walton

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引用次数: 2

摘要

提出了一种从集成电路布置图中提取软故障临界区域的方法。这已经在EYE工具中实现，允许从任意蒙版布局中有效地提取关键区域。本文报道了一种降低缺陷灵敏度的路由网络的缺陷灵敏度比较结果。探讨了缺陷相关可靠性的应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Critical area extraction of extra material soft faults

A method of extracting the extra material critical area of soft faults from an integrated circuit layout is presented. This has been implemented in the EYE tool allowing efficient extraction of the critical area from arbitrary mask layout. Results comparing defect sensitivity of a routing network modified to reduce defect sensitivity are reported. The application to defect related reliability is explored.

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Proceedings of International Workshop on Defect and Fault Tolerance in VLSI

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