铟和氧化锌纳米颗粒对SAC0307-xIn-yZnO无铅锡膏性能的影响

Nadee Mccsathicn, Sawada Makoto, T. Ariga, K. Kanlayasiri
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引用次数: 1

摘要

研究了铟(In)和氧化锌(ZnO)纳米颗粒对SAC0307-xIn-yZnO无铅锡膏性能的影响。将不同浓度的铟和氧化锌纳米颗粒混合在锡膏中。这些颗粒对熔点的影响。对铜基板焊接后的润湿性和界面层进行了研究。结果表明,添加低水平的铟和氧化锌纳米颗粒可以降低SAC0307的熔化温度。适当的铟和氧化锌纳米颗粒浓度增加,钎料在铜基体上的润湿性(接触角)明显降低。氧化锌纳米颗粒对金属间层的厚度值有影响。使焊料和铜衬底之间的分布更低,更均匀。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Influence of indium and zinc oxide nano-particles on properties of SAC0307-xIn-yZnO lead-free solder paste
The influence of indium (In) and zinc oxide (ZnO) nano-particles on the properties of SAC0307-xIn-yZnO lead-free solder paste was presented in this paper. Solder paste was mixed with indium and zinc oxide nano-particles at various concentrations. The influence of these particles on melting point. wettability and interfacial layer after soldering with copper substrate was investigated. The results showed that the addition of lower levels of indium and zinc oxide nano-particles could reduce the melting temperature of SAC0307. Wettability of the solders on copper substrate in terms of contact angle was obviously decreased with the increase of appropriate indium and zinc oxide nano-particle concentration. The zinc oxide nano-particles affected the thickness value of the intermetallic layer. giving it a lower and more uniform distribution between the solder and copper substrate.
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