Nadee Mccsathicn, Sawada Makoto, T. Ariga, K. Kanlayasiri
{"title":"铟和氧化锌纳米颗粒对SAC0307-xIn-yZnO无铅锡膏性能的影响","authors":"Nadee Mccsathicn, Sawada Makoto, T. Ariga, K. Kanlayasiri","doi":"10.1109/EPTC.2015.7412271","DOIUrl":null,"url":null,"abstract":"The influence of indium (In) and zinc oxide (ZnO) nano-particles on the properties of SAC0307-xIn-yZnO lead-free solder paste was presented in this paper. Solder paste was mixed with indium and zinc oxide nano-particles at various concentrations. The influence of these particles on melting point. wettability and interfacial layer after soldering with copper substrate was investigated. The results showed that the addition of lower levels of indium and zinc oxide nano-particles could reduce the melting temperature of SAC0307. Wettability of the solders on copper substrate in terms of contact angle was obviously decreased with the increase of appropriate indium and zinc oxide nano-particle concentration. The zinc oxide nano-particles affected the thickness value of the intermetallic layer. giving it a lower and more uniform distribution between the solder and copper substrate.","PeriodicalId":418705,"journal":{"name":"2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Influence of indium and zinc oxide nano-particles on properties of SAC0307-xIn-yZnO lead-free solder paste\",\"authors\":\"Nadee Mccsathicn, Sawada Makoto, T. Ariga, K. Kanlayasiri\",\"doi\":\"10.1109/EPTC.2015.7412271\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The influence of indium (In) and zinc oxide (ZnO) nano-particles on the properties of SAC0307-xIn-yZnO lead-free solder paste was presented in this paper. Solder paste was mixed with indium and zinc oxide nano-particles at various concentrations. The influence of these particles on melting point. wettability and interfacial layer after soldering with copper substrate was investigated. The results showed that the addition of lower levels of indium and zinc oxide nano-particles could reduce the melting temperature of SAC0307. Wettability of the solders on copper substrate in terms of contact angle was obviously decreased with the increase of appropriate indium and zinc oxide nano-particle concentration. The zinc oxide nano-particles affected the thickness value of the intermetallic layer. giving it a lower and more uniform distribution between the solder and copper substrate.\",\"PeriodicalId\":418705,\"journal\":{\"name\":\"2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPTC.2015.7412271\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2015.7412271","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Influence of indium and zinc oxide nano-particles on properties of SAC0307-xIn-yZnO lead-free solder paste
The influence of indium (In) and zinc oxide (ZnO) nano-particles on the properties of SAC0307-xIn-yZnO lead-free solder paste was presented in this paper. Solder paste was mixed with indium and zinc oxide nano-particles at various concentrations. The influence of these particles on melting point. wettability and interfacial layer after soldering with copper substrate was investigated. The results showed that the addition of lower levels of indium and zinc oxide nano-particles could reduce the melting temperature of SAC0307. Wettability of the solders on copper substrate in terms of contact angle was obviously decreased with the increase of appropriate indium and zinc oxide nano-particle concentration. The zinc oxide nano-particles affected the thickness value of the intermetallic layer. giving it a lower and more uniform distribution between the solder and copper substrate.