Cu和Ag对无铅钎料在高应变速率下屈服行为的影响

K. Meier, M. Roellig, K. Wolter
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引用次数: 2

摘要

汽车或移动应用的电子设备暴露在振动和冲击载荷下,导致PCB和中间层振动。这导致元件焊点内的高应变率。众所周知,焊点表现出应变率相关的屈服行为[1-4],以及应变率依赖于焊料合金成分。焊点合金组成由焊膏和/或焊球组成以及组件和基板的金属化决定。在工业中使用的几种合金成分的应变率取决于屈服行为,已经有许多出版物。研究表明,银含量越高,焊料合金的硬度和脆性越高。然而,屈服行为和应变率敏感性与银和铜含量的直接关系尚未被研究和发表。本文研究了基材Sn99.9和六种无铅钎料合金SnAg1.3 (wt.%)、SnAg3.5、SnCu0.5、SnCu0.7、SnCu0.9和SnAg1.3 cu0.5的屈服行为、应变速率敏感性、变形和断裂行为。所选合金在铸态和等温时效状态下进行了试验。在150°C下时效1000小时。试样通过铸件制造,并以50 K/min的速度快速冷却。如图1所示的试样几何形状为微型狗骨形状,以实现与焊点相当的试样微观和晶粒结构。利用早期工作[5]中引入的高变形速度测试仪进行速率为20 ~ 800 s-1的高应变速率实验。高分辨率在线应力测量揭示了应变率相关的屈服行为。断裂部位的检查给出了损伤行为的信息是通过电子显微镜完成的。采用电子背散射衍射(EBSD)方法分析了晶粒结构水平上的变形行为。局部断裂应变测量显示所有试样具有非常好的延性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The effect of Cu and Ag on the yielding behaviour of lead-free solders at high strain rates
Electronics for automotive or mobile applications are exposed to vibration and shock loads causing PCB and interposer vibration. This leads to high strain rates within the component solder joints. It is known that solder joints show strain rate dependent yield behaviour [1-4] as well as that the strain rate dependency is dependent on the solder alloy composition. The solder joint alloy composition is determined by the solder paste and/or ball composition and the metallisation of the component and the substrate. There have been numerous publications on the strain rate depending yield behaviour of several alloy compositions used in industry. It has been shown that solder alloys behave more stiff and brittle if there is a higher silver content. Still, the direct dependency of yield behaviour and strain rate sensitivity on the silver and copper content has not been investigated and published yet. In this work the base material Sn99.9 and six lead-free solder alloys namely SnAg1.3 (wt.%), SnAg3.5, SnCu0.5, SnCu0.7, SnCu0.9 and SnAg1.3Cu0.5 have been studied for their yielding behaviour, strain rate sensitivity, deformation and fracture behaviour. Selected alloys have been tested in the as cast and isothermally aged state. The ageing was done at 150°C for 1000 h. Specimens were manufactured by casting applying fast cooling with 50 K/min. The specimen geometry as shown in figure 1 is a miniature dogbone shape to achieve a specimen micro- and grain structure comparable to solder joints. A high deformation speed tester introduced in earlier work [5] was utilised to conduct high strain rate experiments at rates from 20 to 800 s-1. High resolution online stress measurement revealed the strain rate dependent yielding behaviour. Fracture site inspection giving information on the damage behaviour was done by electron microscopy. The EBSD (electron backscatter diffraction) option was used to analyse the deformation behaviour at the grain structure level. Local fracture strain measurement revealed a very ductile behaviour of all specimens.
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