纳米尺度弹性成像:一种新的低k介电积分测量工具

Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) Pub Date : 1900-01-01 DOI:10.1109/IITC.2000.854293

G. Shekhawat, O. Kolosov, G. Briggs, E. Shaffer, S.J. Martin, R. Geer

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引用次数: 4

摘要

提出了一种基于超声力显微镜(UFM)的表征工具，用于表征金属/低k聚合物荧光测试结构的纳米级力学性能。根据弹性模量对金属和聚合物区域进行区分，空间分辨率为/spl / 10nm。该技术揭示了低k聚合物在金属/聚合物界面处的rie诱导硬化，并为低k集成过程的计量可靠性评估提供了新的机会。

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Nanoscale elastic imaging: a new metrology tool for low-k dielectric integration

A new characterization tool based on ultrasonic force microscopy (UFM) has been developed to image the nanoscale mechanical properties of metal/low-k polymer damascence test structures. Metal and polymer regions are differentiated on the basis of elastic modulus with a spatial resolution /spl les/10 nm. This technique reveals a RIE-induced hardening of the low-k polymer at the metal/polymer interface and offers new opportunities for metrological reliability evaluation of low-k integration processes.

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来源期刊

Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407)

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