基于深度学习的测试压缩分析器

Cheng-Hung Wu, Yu Huang, Kuen-Jong Lee, Wu-Tung Cheng, Gaurav Veda, S. Reddy, Chun-Cheng Hu, Chong-Siao Ye
{"title":"基于深度学习的测试压缩分析器","authors":"Cheng-Hung Wu, Yu Huang, Kuen-Jong Lee, Wu-Tung Cheng, Gaurav Veda, S. Reddy, Chun-Cheng Hu, Chong-Siao Ye","doi":"10.1109/ATS47505.2019.000-9","DOIUrl":null,"url":null,"abstract":"With the increase in design complexity and test data volume, compressed tests together with on-chip test decompression hardware such as Embedded Deterministic Test (EDTTM) are widely used in industry in order to reduce test cost. One of the challenges of such Design-for-Test (DFT) technology is to determine a set of optimal parameters such as the number of scan chains, scan channels, power budget, etc. such that it can reach the highest test coverage with a minimum amount of test data volume whilst satisfying various other constraints. To achieve the optimal compression configuration quickly, in this work deep learning technology based on Tensorflow is explored to estimate the test coverage and the data volume for a design when employing EDT under a given set of circuit parameters. Based on the estimated data, the optimal test architecture is also predicted, yielding a more efficient approach compared to the currently used trial-and-error methods. To demonstrate the advantages of our deep learning approach over the currently used utility, we present experimental data for eight industrial designs.","PeriodicalId":258824,"journal":{"name":"2019 IEEE 28th Asian Test Symposium (ATS)","volume":"54 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-10-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Deep Learning Based Test Compression Analyzer\",\"authors\":\"Cheng-Hung Wu, Yu Huang, Kuen-Jong Lee, Wu-Tung Cheng, Gaurav Veda, S. Reddy, Chun-Cheng Hu, Chong-Siao Ye\",\"doi\":\"10.1109/ATS47505.2019.000-9\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"With the increase in design complexity and test data volume, compressed tests together with on-chip test decompression hardware such as Embedded Deterministic Test (EDTTM) are widely used in industry in order to reduce test cost. One of the challenges of such Design-for-Test (DFT) technology is to determine a set of optimal parameters such as the number of scan chains, scan channels, power budget, etc. such that it can reach the highest test coverage with a minimum amount of test data volume whilst satisfying various other constraints. To achieve the optimal compression configuration quickly, in this work deep learning technology based on Tensorflow is explored to estimate the test coverage and the data volume for a design when employing EDT under a given set of circuit parameters. Based on the estimated data, the optimal test architecture is also predicted, yielding a more efficient approach compared to the currently used trial-and-error methods. To demonstrate the advantages of our deep learning approach over the currently used utility, we present experimental data for eight industrial designs.\",\"PeriodicalId\":258824,\"journal\":{\"name\":\"2019 IEEE 28th Asian Test Symposium (ATS)\",\"volume\":\"54 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-10-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE 28th Asian Test Symposium (ATS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ATS47505.2019.000-9\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 28th Asian Test Symposium (ATS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ATS47505.2019.000-9","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

摘要

随着设计复杂度和测试数据量的增加,为了降低测试成本,压缩测试与片上测试解压缩硬件如嵌入式确定性测试(EDTTM)被广泛应用于工业中。这种测试设计(Design-for-Test, DFT)技术的挑战之一是确定一组最佳参数,如扫描链的数量、扫描通道、功率预算等,以便在满足各种其他约束的同时,以最小的测试数据量达到最高的测试覆盖率。为了快速实现最优的压缩配置,本文探索了基于Tensorflow的深度学习技术,在给定的电路参数集下,使用EDT来估计设计的测试覆盖率和数据量。基于估计的数据,还预测了最优的测试架构,与目前使用的试错方法相比,产生了更有效的方法。为了证明我们的深度学习方法相对于目前使用的实用程序的优势,我们提供了八个工业设计的实验数据。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Deep Learning Based Test Compression Analyzer
With the increase in design complexity and test data volume, compressed tests together with on-chip test decompression hardware such as Embedded Deterministic Test (EDTTM) are widely used in industry in order to reduce test cost. One of the challenges of such Design-for-Test (DFT) technology is to determine a set of optimal parameters such as the number of scan chains, scan channels, power budget, etc. such that it can reach the highest test coverage with a minimum amount of test data volume whilst satisfying various other constraints. To achieve the optimal compression configuration quickly, in this work deep learning technology based on Tensorflow is explored to estimate the test coverage and the data volume for a design when employing EDT under a given set of circuit parameters. Based on the estimated data, the optimal test architecture is also predicted, yielding a more efficient approach compared to the currently used trial-and-error methods. To demonstrate the advantages of our deep learning approach over the currently used utility, we present experimental data for eight industrial designs.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信