顶层薄层和内层绝缘PID材料的研制

2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Pub Date : 2018-12-01 DOI:10.1109/EPTC.2018.8654403

Toshizumi Yoshino, Toshimasa Nagoshi, S. Nomoto, A. Nakamura, Nobuhito Komuro, Hayato Sawamoto, Yuta Daijima, Yoshikazu Suzuki

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引用次数: 0

摘要

随着电子设备的功能性越来越高，多引脚和更薄封装的半导体正在迅速发展。对于用于这些设备的光敏绝缘，需要高可靠性，例如抗裂性和高加速温度和湿度应力测试(HAST)阻力。

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Development of PID material for top thin layer and inner layer insulation

As the functionality of electronic devices is becoming higher, semiconductors with multiple pins and thinner packages are dramatically proceeding. For the photo sensitive insulation is tied to be used for those devices, high reliability such as crack resistance and Highly Accelerated temperature and humidity Stress Test (HAST) resistance is required.

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2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)

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