Liu Lin-tao, Yu Ming-yan, Ye Yi-zheng, W. Jin-xiang
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With the scaling of CMOS, the system-on-chip (SOC) has become a viable option for RF system. The absence of high Q inductors for CMOS RF has led to an appearance of RF system-in-package. In this paper, we analyze the merit of the package for CMOS RF IC and review development of the package. We focus on LTCC technology and simulate a high performance mixer using stacked spiral inductor.
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