基于cf4和基于ch的等离子体栅极凹陷工艺的AlGaN/GaN hemt的直流和射频特性比较

Bin Hou, Q. Zhu, Lixiang Chen, Xinchuang Zhang, Hengshuang Zhang, Meng Zhang, Minhan Mi, Jiejie Zhu, Ling Yang, Xiaowei Zhou, Xiao-hua Ma, Y. Hao
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引用次数: 0

摘要

制备了基于cf4的等离子体凹槽栅(CF4-RGD)和基于cl2的等离子体凹槽栅(Cl2-RGD)的AlGaN/GaN hemt。CF4-RGD表现出更高的直流和射频性能,峰值Gm为383 mS/mm, fT/fmax为49/153GHz,而Cl2-RGD的峰值Gm为352 mS/mm, fT/fmax为45/118GHz。由于CF4- rgd优异而稳定的特性,CF4等离子体是gan基微波器件中极具潜力的栅极处理工艺。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
DC and RF characteristic comparison of recessed-gate AlGaN/GaN HEMTs with CF4-based and Ch-based plasma gate recessing process
CF4-based plasma recessed gate (CF4-RGD) and Cl2-based plasma recessed gate (Cl2-RGD) AlGaN/GaN HEMTs were fabricated in this paper. CF4-RGD showed higher DC and RF performance with a peak Gm of 383 mS/mm and fT/fmax of 49/153GHz than Cl2-RGD with a peak Gm of 352 mS/mm and fT/fmax of 45/118GHz. Due to the outstanding and stable characteristics of CF4-RGD, CF4 plasma is a promising candidate for the gate recessing process in fabrication of GaN-based microwave applications.
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