{"title":"锡膏检验:减少缺陷的过程控制","authors":"D. Burr","doi":"10.1109/TEST.1997.639726","DOIUrl":null,"url":null,"abstract":"As quality control for SMT electronics assembly shifts from final inspection/final test to production line monitoring and process control, there is a greater emphasis on post-print solder paste inspection as a means of reducing the number of defects appearing on finished boards. Automatic post-print inspection systems provide operators with the continuous information required to implement in-line continuous process control, identifying out-of-spec trends so that printing problems can be corrected before defective boards are produced.","PeriodicalId":186340,"journal":{"name":"Proceedings International Test Conference 1997","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Solder paste inspection: process control for defect reduction\",\"authors\":\"D. Burr\",\"doi\":\"10.1109/TEST.1997.639726\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As quality control for SMT electronics assembly shifts from final inspection/final test to production line monitoring and process control, there is a greater emphasis on post-print solder paste inspection as a means of reducing the number of defects appearing on finished boards. Automatic post-print inspection systems provide operators with the continuous information required to implement in-line continuous process control, identifying out-of-spec trends so that printing problems can be corrected before defective boards are produced.\",\"PeriodicalId\":186340,\"journal\":{\"name\":\"Proceedings International Test Conference 1997\",\"volume\":\"8 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-11-03\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings International Test Conference 1997\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TEST.1997.639726\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings International Test Conference 1997","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TEST.1997.639726","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Solder paste inspection: process control for defect reduction
As quality control for SMT electronics assembly shifts from final inspection/final test to production line monitoring and process control, there is a greater emphasis on post-print solder paste inspection as a means of reducing the number of defects appearing on finished boards. Automatic post-print inspection systems provide operators with the continuous information required to implement in-line continuous process control, identifying out-of-spec trends so that printing problems can be corrected before defective boards are produced.
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