有机多层pcb热通孔结构的有效热建模评价与无损检测

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI:10.1109/ESTC.2008.4684489

R. Schacht, B. Wunderle, D. May, M. Abo Ras, W. Faust, B. Michel, H. Reichl

{"title":"有机多层pcb热通孔结构的有效热建模评价与无损检测","authors":"R. Schacht, B. Wunderle, D. May, M. Abo Ras, W. Faust, B. Michel, H. Reichl","doi":"10.1109/ESTC.2008.4684489","DOIUrl":null,"url":null,"abstract":"This paper derives and evaluates an effective thermal material simulation model in simula-tion and experiment as well as proposes a non-destructive failure analysis for multi-layer sub-strates with thermal or electrical vias to derive exact failure data to supplement existing life-time models.","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":"115 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Effective thermal modelling evaluation and non-destructive tests for thermal via-structures in organic multi layer PCBs\",\"authors\":\"R. Schacht, B. Wunderle, D. May, M. Abo Ras, W. Faust, B. Michel, H. Reichl\",\"doi\":\"10.1109/ESTC.2008.4684489\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper derives and evaluates an effective thermal material simulation model in simula-tion and experiment as well as proposes a non-destructive failure analysis for multi-layer sub-strates with thermal or electrical vias to derive exact failure data to supplement existing life-time models.\",\"PeriodicalId\":146584,\"journal\":{\"name\":\"2008 2nd Electronics System-Integration Technology Conference\",\"volume\":\"115 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-11-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 2nd Electronics System-Integration Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESTC.2008.4684489\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 2nd Electronics System-Integration Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESTC.2008.4684489","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 7

摘要

本文在仿真和实验中推导并评价了一种有效的热材料仿真模型，并提出了一种对带有热孔或电孔的多层衬底进行无损失效分析的方法，以获得准确的失效数据，以补充现有的寿命模型。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Effective thermal modelling evaluation and non-destructive tests for thermal via-structures in organic multi layer PCBs

This paper derives and evaluates an effective thermal material simulation model in simula-tion and experiment as well as proposes a non-destructive failure analysis for multi-layer sub-strates with thermal or electrical vias to derive exact failure data to supplement existing life-time models.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2008 2nd Electronics System-Integration Technology Conference

自引率

0.00%

发文量