无铅互连材料用银铜合金纳米颗粒的合成

Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. Pub Date : 2005-03-16 DOI:10.1109/ISAPM.2005.1432072

Hongjin Jiang, K. Moon, C. Wong

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引用次数: 38

摘要

采用多元醇法制备了银铜合金纳米颗粒，用于导电胶粘剂的导电填料制备。紫外吸收和透射电镜观察表明，合成的银铜纳米粒子具有随机混合的合金结构，而不是核壳结构，尽管大块银和铜在室温下不能形成固溶体。

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Synthesis of Ag-Cu alloy nanoparticles for lead-free interconnect materials

Silver-copper alloy nanoparticles were synthesized via the polyol process in preparation for the conductive fillers in electrically conductive adhesives. UV absorption and TEM observations showed that the synthesized silver-copper nanoparticles had a randomly mixed alloy structure rather than a core-shell structure, although bulk silver and copper cannot form a solid solution at room temperature.

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Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.

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