嵌入式缺陷的掠角FIB分层及PVC故障隔离分析

Y. Shen, Ye Chen, Kok Wah Lee, Jie Zhu, Z. Mo
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引用次数: 0

摘要

本文报道了一种利用掠角FIB铣削进行IC失效分析的脱层方法的工作流程。这种方法不需要切割样品的横截面,这会增加破坏目标结构的风险。相反,在掠角FIB铣削之前,使用精确激光烧蚀和FIB铣削的组合来创建一个大的观察窗口。我们的研究结果表明,该方法可以成为传统机械和/或化学抛光的有用替代品,并成功地应用于几个案例研究中,用于分析嵌入式缺陷或被动电压对比(PVC)故障隔离。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Glancing Angle FIB De-layering for Embedded Defect and PVC Fault Isolation Analysis
In this work we reported a work flow of de-layering method by using glancing angle FIB milling for IC failure analysis. This method doesn't require cleaving the sample cross-section which increases risk of damaging target structure. Instead, a combination of precise laser ablation and FIB milling is used to create a large viewing window before glancing angle FIB milling. Our results demonstrated that the method can become useful alternative of conventional mechanical and/or chemical polishing and were successfully applied in several case studies for analyzing embedded defect or passive voltage contrast (PVC) fault isolation.
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