T. Hiramoto, N. Tamba, M. Yoshida, T. Hashimoto, T. Fujiwara, K. Watanabe, M. Odaka, M. Usami, T. Ikeda
{"title":"一种27 GHz双多晶硅双极技术，在键合SOI上嵌入58 μ m/sup / CMOS存储单元，用于ECL-CMOS SRAM应用","authors":"T. Hiramoto, N. Tamba, M. Yoshida, T. Hashimoto, T. Fujiwara, K. Watanabe, M. Odaka, M. Usami, T. Ikeda","doi":"10.1109/IEDM.1992.307304","DOIUrl":null,"url":null,"abstract":"A double polysilicon bipolar technology with high-speed, high-packing density, low power consumption, and high alpha -particle immunity has been newly developed. Bonded SOI substrates are used to improve the alpha -particle immunity, and scaled CMOS memory cells are introduced to reduce the power consumption and to increase the packing density. The cut-off frequency of the bipolar transistors is as high as 27 GHz and the area of the CMOS memory cell is 58 mu m/sup 2/. This technology is promising for application to ultra high-speed, high-density LSIs with ECL-CMOS scheme.<<ETX>>","PeriodicalId":287098,"journal":{"name":"1992 International Technical Digest on Electron Devices Meeting","volume":"77 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"20","resultStr":"{\"title\":\"A 27 GHz double polysilicon bipolar technology on bonded SOI with embedded 58 mu m/sup 2/ CMOS memory cells for ECL-CMOS SRAM applications\",\"authors\":\"T. Hiramoto, N. Tamba, M. Yoshida, T. Hashimoto, T. Fujiwara, K. Watanabe, M. Odaka, M. Usami, T. Ikeda\",\"doi\":\"10.1109/IEDM.1992.307304\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A double polysilicon bipolar technology with high-speed, high-packing density, low power consumption, and high alpha -particle immunity has been newly developed. Bonded SOI substrates are used to improve the alpha -particle immunity, and scaled CMOS memory cells are introduced to reduce the power consumption and to increase the packing density. The cut-off frequency of the bipolar transistors is as high as 27 GHz and the area of the CMOS memory cell is 58 mu m/sup 2/. This technology is promising for application to ultra high-speed, high-density LSIs with ECL-CMOS scheme.<<ETX>>\",\"PeriodicalId\":287098,\"journal\":{\"name\":\"1992 International Technical Digest on Electron Devices Meeting\",\"volume\":\"77 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"20\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1992 International Technical Digest on Electron Devices Meeting\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEDM.1992.307304\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1992 International Technical Digest on Electron Devices Meeting","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.1992.307304","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A 27 GHz double polysilicon bipolar technology on bonded SOI with embedded 58 mu m/sup 2/ CMOS memory cells for ECL-CMOS SRAM applications
A double polysilicon bipolar technology with high-speed, high-packing density, low power consumption, and high alpha -particle immunity has been newly developed. Bonded SOI substrates are used to improve the alpha -particle immunity, and scaled CMOS memory cells are introduced to reduce the power consumption and to increase the packing density. The cut-off frequency of the bipolar transistors is as high as 27 GHz and the area of the CMOS memory cell is 58 mu m/sup 2/. This technology is promising for application to ultra high-speed, high-density LSIs with ECL-CMOS scheme.<>
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