Bringing manufacturing into design via process-dependent SPICE models

This paper describes methodology for constructing compact SPICE models as a function of process parameter variations. The methodology involves global extraction of process-dependant SPICE model parameters from silicon calibrated TCAD simulations. The model is validated by comparing device characteristics from the extracted SPICE parameters with those from TCAD simulations. The analysis demonstrates an excellent goodness of fit over the full range of process parameter variations. The process-dependant SPICE models allow direct access to process parameter variations in circuit design. The extracted models are employed in rudimentary digital circuits to investigate the delay variation in response to process deviations. The proposed approach significantly improves design-for-manufacturing (DFM) by allowing for accurate design sensitivity analysis and parametric yield assessment, as a function of statistically independent and measurable process variations