7th International Symposium on Quality Electronic Design (ISQED'06)最新文献

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Delay fault diagnosis for nonrobust test 非鲁棒试验延迟故障诊断
7th International Symposium on Quality Electronic Design (ISQED'06) Pub Date : 2006-03-27 DOI: 10.1109/ISQED.2006.45
V. Mehta, M. Marek-Sadowska, Zhiyuan Wang, Kun-Han Tsai, J. Rajski
{"title":"Delay fault diagnosis for nonrobust test","authors":"V. Mehta, M. Marek-Sadowska, Zhiyuan Wang, Kun-Han Tsai, J. Rajski","doi":"10.1109/ISQED.2006.45","DOIUrl":"https://doi.org/10.1109/ISQED.2006.45","url":null,"abstract":"With feature sizes steadily shrinking, manufacturing defects and parameter variations often cause design timing failures. It is essential that those errors be correctly and quickly diagnosed. The existing delay-fault diagnosis algorithms cannot identify the delay faults that require nonrobust tests, because they ignore nonrobust propagation conditions while emulating the failure analyzer's behavior. We propose a novel approach to perform delay-fault diagnosis for robust and nonrobust tests. The experimental results show that our approach can diagnose delay faults with good resolution. It is stable with respect to delay variations that the failure analyzer might experience","PeriodicalId":138839,"journal":{"name":"7th International Symposium on Quality Electronic Design (ISQED'06)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114973317","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
Variational interconnect delay metrics for statistical timing analysis 用于统计时序分析的变分互连延迟度量
7th International Symposium on Quality Electronic Design (ISQED'06) Pub Date : 2006-03-27 DOI: 10.1109/ISQED.2006.143
P. Ghanta, S. Vrudhula
{"title":"Variational interconnect delay metrics for statistical timing analysis","authors":"P. Ghanta, S. Vrudhula","doi":"10.1109/ISQED.2006.143","DOIUrl":"https://doi.org/10.1109/ISQED.2006.143","url":null,"abstract":"For statistical timing analysis and physical design optimization, interconnect delay metrics that model the delay as a function of the metal process variations are very important. Accurate linear or at most second order delay models in terms of the process variables are necessary to efficiently propagate uncertainty in the state-of-the-art VLSI designs with millions of transistors and on chip interconnects. In this paper, we develop a method to extend the traditional moment based delay analysis of interconnects to consider the impact of Gaussian metal process variations and obtain mean-square optimal linear delay models for interconnects. We consider linear models for the variations in the conductance and capacitance of interconnects and represent the moments (m0, m1, m2) of the interconnect impulse response as a first order orthogonal polynomial series expansion in the process variables. We obtain the coefficients of the expansion by using the Galerkin residual error minimization method on the recursive equations that relate the interconnect moments (m0, m1 , m2). We compare the accuracy of our approach against SPICE based Monte Carlo simulations and demonstrate a good match","PeriodicalId":138839,"journal":{"name":"7th International Symposium on Quality Electronic Design (ISQED'06)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123132378","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 14
Fast sequential cell noise immunity characterization using meta-stable point of feedback loop 基于反馈回路亚稳定点的快速序列细胞抗噪特性研究
7th International Symposium on Quality Electronic Design (ISQED'06) Pub Date : 2006-03-27 DOI: 10.1109/ISQED.2006.67
N. Oh, Li Ding, Alireza Kasnavi
{"title":"Fast sequential cell noise immunity characterization using meta-stable point of feedback loop","authors":"N. Oh, Li Ding, Alireza Kasnavi","doi":"10.1109/ISQED.2006.67","DOIUrl":"https://doi.org/10.1109/ISQED.2006.67","url":null,"abstract":"Noise glitches can cause functional errors or failures if they are latched into sequential cells. Thus it is very important to determine or characterize noise failure criteria of sequential cells. However, characterizing noise failure criteria of sequential cells is very computationally expensive because it often requires multiple transient simulations with different clock waveform shapes and alignments, known as clock sweeping. In this paper, we propose a new technique that eliminates the clock sweeping by using the meta-stable point of sequential cells. Our experiments with industrial circuits have shown that the proposed method is on average 58times faster than the conventional clock sweeping method and its average error is only 2.4%","PeriodicalId":138839,"journal":{"name":"7th International Symposium on Quality Electronic Design (ISQED'06)","volume":"251 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120974120","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Minimizing FPGA reconfiguration data at logic level 最小化FPGA在逻辑级的重构数据
7th International Symposium on Quality Electronic Design (ISQED'06) Pub Date : 2006-03-27 DOI: 10.1109/ISQED.2006.87
K. Raghuraman, Haibo Wang, S. Tragoudas
{"title":"Minimizing FPGA reconfiguration data at logic level","authors":"K. Raghuraman, Haibo Wang, S. Tragoudas","doi":"10.1109/ISQED.2006.87","DOIUrl":"https://doi.org/10.1109/ISQED.2006.87","url":null,"abstract":"A framework that relates the size of FPGA reconfiguration data to the number of minterms of a specially constructed function is presented. Three techniques, variable mapping optimization, circuit don't-care modification, and look-up table input permutation, are developed to minimize minterms of the special function. The method to integrate the proposed techniques into FPGA design automation flow is discussed and experimental results are presented","PeriodicalId":138839,"journal":{"name":"7th International Symposium on Quality Electronic Design (ISQED'06)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127197518","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Enhancement of signal integrity and power integrity with embedded capacitors in high-speed packages 高速封装中嵌入电容增强信号完整性和功率完整性
7th International Symposium on Quality Electronic Design (ISQED'06) Pub Date : 2006-03-27 DOI: 10.1109/ISQED.2006.60
K. Srinivasan, P. Muthana, R. Mandrekar, E. Engin, Jinwoo Choi, M. Swaminathan
{"title":"Enhancement of signal integrity and power integrity with embedded capacitors in high-speed packages","authors":"K. Srinivasan, P. Muthana, R. Mandrekar, E. Engin, Jinwoo Choi, M. Swaminathan","doi":"10.1109/ISQED.2006.60","DOIUrl":"https://doi.org/10.1109/ISQED.2006.60","url":null,"abstract":"Improvements in electrical performance of microelectronic systems can be achieved by the integration of passive elements such as capacitors, resistors and inductors. The advantage of embedded passives is their low parasitic values. In this paper, enhancement of signal-integrity and power-integrity is investigated when a high-k planar capacitor is used as a power-ground plane, with embedded high-k discrete capacitors that have low ESI and ESR values as decoupling capacitors for SSN suppression. In order to capture the effects of embedded capacitor performance, a test-structure involving many signal-lines referenced to a power-ground plane was simulated. Simulation results show that the high-k planar capacitor reduces coupling of noise currents through the power-ground planes and helps improve the eye-opening. Simulation results have been quantified for a case, where a fewer number of embedded discrete capacitors helps reduce SSN more significantly than surface-mounts. Transient co-simulation of the signal delivery network (SDN) and the power-delivery network (PDN) are performed using Y-parameters","PeriodicalId":138839,"journal":{"name":"7th International Symposium on Quality Electronic Design (ISQED'06)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127258126","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 15
Impact of gate-length biasing on threshold-voltage selection 门长偏置对阈值电压选择的影响
7th International Symposium on Quality Electronic Design (ISQED'06) Pub Date : 2006-03-27 DOI: 10.1109/ISQED.2006.72
A. Kahng, S. Muddu, P. Sharma
{"title":"Impact of gate-length biasing on threshold-voltage selection","authors":"A. Kahng, S. Muddu, P. Sharma","doi":"10.1109/ISQED.2006.72","DOIUrl":"https://doi.org/10.1109/ISQED.2006.72","url":null,"abstract":"Gate-length biasing is a runtime leakage reduction technique that leverages on the short-channel effect by marginally increasing the gate-length of MOS devices to significantly reduce their leakage current for a small delay penalty. The technique was shown to work effectively with multi-threshold-voltage assignment, the only mainstream approach for runtime leakage reduction. Typically, designers use threshold voltages selected by the foundries to optimize their designs. Higher threshold-voltage devices, that are less leaky but slow, are assigned to non-critical paths and lower threshold-voltage devices, that are fast but leaky, are assigned to critical paths. In this paper we study the effect of modifying threshold voltages set by the foundry on leakage reduction achieved on three large, real-world designs. We assess the impact of the availability of gate-length biasing on threshold voltage selection. We achieve comparable leakage reductions when foundry-set dual threshold voltages are used with biasing than when foundry-set triple threshold voltages are used without biasing. Our results indicate that leakage reductions can be improved if threshold voltages are carefully chosen considering the availability of gate-length biasing. We also observe that foundry-set threshold voltages are not optimal for achieving best possible leakage reductions","PeriodicalId":138839,"journal":{"name":"7th International Symposium on Quality Electronic Design (ISQED'06)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126071335","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
Process window and device variations evaluation using array-based characterization circuits 使用基于阵列的表征电路的工艺窗口和器件变化评估
7th International Symposium on Quality Electronic Design (ISQED'06) Pub Date : 2006-03-27 DOI: 10.1109/ISQED.2006.107
C. Tabery, M. Craig, G. Burbach, B. Wagner, S. McGowan, P. Etter, S. Roling, C. Haidinyak, E. Ehrichs
{"title":"Process window and device variations evaluation using array-based characterization circuits","authors":"C. Tabery, M. Craig, G. Burbach, B. Wagner, S. McGowan, P. Etter, S. Roling, C. Haidinyak, E. Ehrichs","doi":"10.1109/ISQED.2006.107","DOIUrl":"https://doi.org/10.1109/ISQED.2006.107","url":null,"abstract":"Highly customizable and scaleable scribe-based circuits have been demonstrated as effective tools for gathering process window response curves and variations data not easily obtained through standard electrical test structure approaches or inline characterization. This work demonstrates the feasibility of using these types of circuits in design rule definition, mask validation, lithography margining, and OPC qualification and refinement. Finally, given their small form factors, they are easily adopted in high-volume manufacturing environments as process monitoring tools","PeriodicalId":138839,"journal":{"name":"7th International Symposium on Quality Electronic Design (ISQED'06)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125361744","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 14
Accurate thermal analysis considering nonlinear thermal conductivity 考虑非线性导热系数的精确热分析
7th International Symposium on Quality Electronic Design (ISQED'06) Pub Date : 2006-03-27 DOI: 10.1109/ISQED.2006.20
Anand Ramalingam, D. Pan, Frank Liu, S. Nassif
{"title":"Accurate thermal analysis considering nonlinear thermal conductivity","authors":"Anand Ramalingam, D. Pan, Frank Liu, S. Nassif","doi":"10.1109/ISQED.2006.20","DOIUrl":"https://doi.org/10.1109/ISQED.2006.20","url":null,"abstract":"The increase in packing density has led to a higher power density in the chip which in turn has led to an increase in temperature on the chip. Temperature affects reliability, performance and power directly, motivating the need to accurately simulate the thermal profile of a chip. In literature, thermal conductivity is assumed to be a constant in order to obtain a linear system of equations which can be solved efficiently. But thermal conductivity is a nonlinear function of temperature and for silicon it varies by 22% over the range 27-80deg C (McConnell et al., 2001). If the nonlinearity of the thermal conductivity is ignored the thermal profile might be off by 10deg C. Thus to get an accurate thermal profile it is important to consider the nonlinear dependence of the thermal conductivity on temperature. In this work the nonlinear system arising out of considering the nonlinear thermal conductivity is solved efficiently using a variant of Newton-Raphson. We also study the abstraction levels under which the approximation of a periodic source by a DC source is valid","PeriodicalId":138839,"journal":{"name":"7th International Symposium on Quality Electronic Design (ISQED'06)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123915603","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Modular service-oriented platform architecture - a key enabler to SoC design quality 模块化面向服务的平台架构——SoC设计质量的关键推动者
7th International Symposium on Quality Electronic Design (ISQED'06) Pub Date : 2006-03-27 DOI: 10.1109/ISQED.2006.89
R. Suoranta
{"title":"Modular service-oriented platform architecture - a key enabler to SoC design quality","authors":"R. Suoranta","doi":"10.1109/ISQED.2006.89","DOIUrl":"https://doi.org/10.1109/ISQED.2006.89","url":null,"abstract":"In the digital convergence era, new products are created at ever faster pace by combining and integrating existing and new technologies in innovative ways. Designers of these products are already facing immense productivity and quality demands. We need new architectural thinking to address the demands of the future. We need to achieve very high-level of reuse and at the same time manage the system complexity. Platformization and modularity are the key to do this. The key to true system modularity is an architectural model where the functional and physical architecture are aligned.","PeriodicalId":138839,"journal":{"name":"7th International Symposium on Quality Electronic Design (ISQED'06)","volume":"171 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123472744","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Statistical analysis of capacitance coupling effects on delay and noise 电容耦合对时延和噪声影响的统计分析
7th International Symposium on Quality Electronic Design (ISQED'06) Pub Date : 2006-03-27 DOI: 10.1109/ISQED.2006.121
U. Narasimha, Binu Abraham, N. Nagaraj
{"title":"Statistical analysis of capacitance coupling effects on delay and noise","authors":"U. Narasimha, Binu Abraham, N. Nagaraj","doi":"10.1109/ISQED.2006.121","DOIUrl":"https://doi.org/10.1109/ISQED.2006.121","url":null,"abstract":"Statistical static timing analysis (SSTA) tools have mostly addressed the process variations of devices and lumped interconnect RC effects. This paper provides an overview of interconnect process variations of capacitive coupling and its effect on crosstalk delay and noise. The correlations among parallel plate, lateral and total capacitance is shown. Correlations between resistance and capacitance are illustrated to enable development of a simple and efficient model for delay and noise analysis. Experimental results are shown to validate the assumptions on the linearity of sensitivity of delay and noise to process variations. A methodology to account for process variations in crosstalk delay and noise is proposed","PeriodicalId":138839,"journal":{"name":"7th International Symposium on Quality Electronic Design (ISQED'06)","volume":"2015 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128032039","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
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