{"title":"氮化镓光耦合器的单片集成","authors":"Chengshiun Liou, C. Tsou","doi":"10.1109/IMFEDK56875.2022.9975305","DOIUrl":null,"url":null,"abstract":"This paper proposed a GaN-based optocoupler chip with monolithic integration. It differs from commercial photodiode optocouplers consisting of at least two coupled chips. This study monolithically integrated a photodiode and a light emitting diode on a sapphire substrate as a single chip. This approach makes the optical transmission of signal in a thin sapphire substrate with a micro-meter scale transmission path reducing light loss. In the experiment, the measurement results showed that the proposed chip has a great current transfer ratio. It meets commercial specifications and provides a more efficient optocoupler manufacturing solution.","PeriodicalId":162017,"journal":{"name":"2022 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-11-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Monolithic Integration of GaN-based Optocoupler\",\"authors\":\"Chengshiun Liou, C. Tsou\",\"doi\":\"10.1109/IMFEDK56875.2022.9975305\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper proposed a GaN-based optocoupler chip with monolithic integration. It differs from commercial photodiode optocouplers consisting of at least two coupled chips. This study monolithically integrated a photodiode and a light emitting diode on a sapphire substrate as a single chip. This approach makes the optical transmission of signal in a thin sapphire substrate with a micro-meter scale transmission path reducing light loss. In the experiment, the measurement results showed that the proposed chip has a great current transfer ratio. It meets commercial specifications and provides a more efficient optocoupler manufacturing solution.\",\"PeriodicalId\":162017,\"journal\":{\"name\":\"2022 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK)\",\"volume\":\"18 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2022-11-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2022 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IMFEDK56875.2022.9975305\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMFEDK56875.2022.9975305","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
This paper proposed a GaN-based optocoupler chip with monolithic integration. It differs from commercial photodiode optocouplers consisting of at least two coupled chips. This study monolithically integrated a photodiode and a light emitting diode on a sapphire substrate as a single chip. This approach makes the optical transmission of signal in a thin sapphire substrate with a micro-meter scale transmission path reducing light loss. In the experiment, the measurement results showed that the proposed chip has a great current transfer ratio. It meets commercial specifications and provides a more efficient optocoupler manufacturing solution.