电子封装跌落冲击损伤预测与传播的围动力学理论

2008 58th Electronic Components and Technology Conference Pub Date : 2008-05-27 DOI:10.1109/ECTC.2008.4550105

A. Agwai, I. Guven, E. Madenci

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引用次数: 15

摘要

本文采用周动力学理论研究了电子封装在跌落冲击载荷作用下的动态响应。首先，简要描述了该理论，然后针对一个基本的动态断裂问题进行了验证。最后，结合跌落试验验证了周动力学理论。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Peridynamic theory for impact damage prediction and propagation in electronic packages due to drop

In this study, peridynamic theory is used to investigate dynamic response of electronic packages subjected to impact loading arising from drop-shock. First, the theory is briefly described, followed by validation against a fundamental dynamic fracture problem. Finally, peridynamic theory was demonstrated by considering a drop test experiment.

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2008 58th Electronic Components and Technology Conference

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