用模型检查分析PowerPC/sup TM/ 620微处理器硅故障

R. Raimi, J. Lear
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引用次数: 6

摘要

当硅可用时,新设计的微处理器在专门配备的硬件实验室中进行测试,在那里实际应用可以以硬件速度运行。然而,正在运行的大量代码,加上对芯片内部节点的有限访问,使得描述发生的任何故障的性质变得非常困难。在本文中,我们描述了如何使用时态逻辑模型检查的形式验证技术来快速表征powerpc620微处理器硬件测试期间出现的设计错误。我们声称,当满足某些前提条件时,模型检查可以有效地表征此类故障。我们还展示了在设计周期的早期,通过模型检查一个简短的正确性规范,可以发现相同的错误。我们将讨论这对整个设计周期的验证方法的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Analyzing a PowerPC/sup TM/ 620 microprocessor silicon failure using model checking
When silicon is available, newly designed microprocessors ore tested in specially equipped hardware laboratories, where real applications can be run at hardware speeds. However, the large volumes of code being run, plus the limited access to the internal nodes of the chip, make it extraordinarily difficult to characterize the nature of any failures that occur. In this paper, we describe how the formal verification technique of temporal logic model checking was used to quickly characterize a design error exhibited during hardware testing of the PowerPC 620 microprocessor. We claim that model checking can efficiently characterize such failures when certain pre-conditions are met. We also show how the same error could have been revealed early in the design cycle, by model checking a short and simple correctness specification. We discuss the implications of this for verification methodologies over the full design cycle.
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