金和铜的球键由于金属间氧化和腐蚀而失效

C. Breach, Ng Hun Shen, T. Lee, R. Holliday
{"title":"金和铜的球键由于金属间氧化和腐蚀而失效","authors":"C. Breach, Ng Hun Shen, T. Lee, R. Holliday","doi":"10.1109/IPFA.2011.5992790","DOIUrl":null,"url":null,"abstract":"Strong interest in the replacement of gold bonding wire by copper in microelectronics packaging has highlighted poor performance of copper wire under moist conditions. Attempts have been made to address this problem by coating copper wire with palladium, which may be a solution for some applications but ignores the fundamental reasons for the poor performance of copper wire. Gold and copper ball bonds were isothermally aged under moist conditions (85°C and 85% relative humidity (RH)) in an effort to better understand the corrosion mechanisms. This paper presents ideas on the origins of the moisture sensitivity of copper and gold ball bonds on aluminium alloy bond pads, drawing on experimental data from this study, results from recently published literature and established knowledge on moisture induced degradation of intermetallics.","PeriodicalId":312315,"journal":{"name":"18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-07-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Failure of gold and copper ball bonds due to intermetallic oxidation and corrosion\",\"authors\":\"C. Breach, Ng Hun Shen, T. Lee, R. Holliday\",\"doi\":\"10.1109/IPFA.2011.5992790\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Strong interest in the replacement of gold bonding wire by copper in microelectronics packaging has highlighted poor performance of copper wire under moist conditions. Attempts have been made to address this problem by coating copper wire with palladium, which may be a solution for some applications but ignores the fundamental reasons for the poor performance of copper wire. Gold and copper ball bonds were isothermally aged under moist conditions (85°C and 85% relative humidity (RH)) in an effort to better understand the corrosion mechanisms. This paper presents ideas on the origins of the moisture sensitivity of copper and gold ball bonds on aluminium alloy bond pads, drawing on experimental data from this study, results from recently published literature and established knowledge on moisture induced degradation of intermetallics.\",\"PeriodicalId\":312315,\"journal\":{\"name\":\"18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"volume\":\"12 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-07-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IPFA.2011.5992790\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPFA.2011.5992790","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7

摘要

在微电子封装中用铜代替金键合线的强烈兴趣突出了铜线在潮湿条件下的不良性能。为了解决这个问题,人们已经尝试在铜线上涂上钯,这可能是一些应用的解决方案,但忽略了铜线性能差的根本原因。为了更好地了解腐蚀机制,在潮湿条件下(85°C和85%相对湿度(RH))对金和铜球键进行等温老化。本文根据本研究的实验数据、最近发表的文献和关于金属间化合物水分诱导降解的既定知识,提出了铝合金键垫上铜和金球键的水分敏感性的来源。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Failure of gold and copper ball bonds due to intermetallic oxidation and corrosion
Strong interest in the replacement of gold bonding wire by copper in microelectronics packaging has highlighted poor performance of copper wire under moist conditions. Attempts have been made to address this problem by coating copper wire with palladium, which may be a solution for some applications but ignores the fundamental reasons for the poor performance of copper wire. Gold and copper ball bonds were isothermally aged under moist conditions (85°C and 85% relative humidity (RH)) in an effort to better understand the corrosion mechanisms. This paper presents ideas on the origins of the moisture sensitivity of copper and gold ball bonds on aluminium alloy bond pads, drawing on experimental data from this study, results from recently published literature and established knowledge on moisture induced degradation of intermetallics.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信