不同三维芯片结构的电磁兼容性的系统方法和比较

2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559) Pub Date : 2004-11-01 DOI:10.1109/ISEMC.2004.1349894

M. Uusimaki, A. Renko

{"title":"不同三维芯片结构的电磁兼容性的系统方法和比较","authors":"M. Uusimaki, A. Renko","doi":"10.1109/ISEMC.2004.1349894","DOIUrl":null,"url":null,"abstract":"A systematic approach to estimate electromagnetic compatibility (EMC) issues in 3D package stacking is introduced. Five different structures are described and compared using a systematic method for electromagnetic compatibility investigation. The method consists of dividing different mechanical structures into smaller segments, which can be studied individually and in such a way that the EMC study is made simpler and can focus on one detail at a time. Estimations of importance of each segments is performed in reference to existing knowledge/data base. Simulations are generated to estimate the coupling effects in selected critical areas. This study highlights the strong points and weak points of the stacking methods investigated. Also the studied cases are arranged in the order of preference, namely, from EMC friendly to EMC disaster.","PeriodicalId":378094,"journal":{"name":"2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"A systematic approach and comparison of different 3-D chip structures for electromagnetic compatibility\",\"authors\":\"M. Uusimaki, A. Renko\",\"doi\":\"10.1109/ISEMC.2004.1349894\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A systematic approach to estimate electromagnetic compatibility (EMC) issues in 3D package stacking is introduced. Five different structures are described and compared using a systematic method for electromagnetic compatibility investigation. The method consists of dividing different mechanical structures into smaller segments, which can be studied individually and in such a way that the EMC study is made simpler and can focus on one detail at a time. Estimations of importance of each segments is performed in reference to existing knowledge/data base. Simulations are generated to estimate the coupling effects in selected critical areas. This study highlights the strong points and weak points of the stacking methods investigated. Also the studied cases are arranged in the order of preference, namely, from EMC friendly to EMC disaster.\",\"PeriodicalId\":378094,\"journal\":{\"name\":\"2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISEMC.2004.1349894\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.2004.1349894","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

介绍了一种系统的三维封装堆叠中电磁兼容性问题的估计方法。用系统的方法对五种不同的结构进行了描述和比较。该方法包括将不同的机械结构分成更小的部分，这些部分可以单独研究，从而使电磁兼容研究变得更简单，并且可以一次专注于一个细节。根据现有的知识/数据库对每个片段的重要性进行估计。通过模拟来估计在选定的关键区域的耦合效应。本研究突出了所研究的叠加方法的优点和缺点。研究案例按优先顺序排列，即从EMC友好型到EMC灾难型。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

A systematic approach and comparison of different 3-D chip structures for electromagnetic compatibility

A systematic approach to estimate electromagnetic compatibility (EMC) issues in 3D package stacking is introduced. Five different structures are described and compared using a systematic method for electromagnetic compatibility investigation. The method consists of dividing different mechanical structures into smaller segments, which can be studied individually and in such a way that the EMC study is made simpler and can focus on one detail at a time. Estimations of importance of each segments is performed in reference to existing knowledge/data base. Simulations are generated to estimate the coupling effects in selected critical areas. This study highlights the strong points and weak points of the stacking methods investigated. Also the studied cases are arranged in the order of preference, namely, from EMC friendly to EMC disaster.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2004 International Symposium on Electromagnetic Compatibility (IEEE Cat. No.04CH37559)

自引率

0.00%

发文量