离散功率器件和功率模块复杂热特性的测定

M. Rencz, A. Poppe, G. Farkas
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引用次数: 0

摘要

功率器件的工作电流、电压和温度通常都很高,而且相对较大的器件区域在结构的物理边界(如基板等)处的温度不均匀,这给热表征带来了新的挑战。本文介绍了考虑功率器件开关特性的各种热表征方法。提出了基于结构紧凑热模型的间接温度估计和直接温度测量方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Determination of the Complex Thermal Characteristics of Discrete Power Devices and Power Modules
Power devices raise new challenges in thermal characterization, as usually the operating currents, voltages and temperatures are high, and the relatively large device areas are represented by non-uniform temperatures at the physical boundaries of the structure, such as base plate, etc. The paper presents various methods for the thermal characterization of power devices, taking into consideration their switching characteristics. Both indirect temperature estimations based on the compact thermal model of the structure and direct temperature measurement methods are proposed.
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