用于低耗散微机械谐振器的高导热多晶金刚石

2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS) Pub Date : 2014-03-13 DOI:10.1109/MEMSYS.2014.6765719

H. Najar, A. Thron, C. Yang, S. Fung, K. van Benthem, L. Lin, D. Horsley

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引用次数: 7

摘要

本文报道了在不同条件下沉积微晶金刚石(MCD)薄膜以提高微机械谐振器的热导率和机械品质因子(Q)的研究。通过研究不同的沉积条件，我们证明了热导率和质量因子增加了三倍。对双端音叉谐振器进行了质量因子测量，退火后在fn = 246.86 kHz处Q = 241,047，这是多晶金刚石谐振器的最高Q值。我们进一步研究了热丝化学气相沉积(HFCVD)金刚石薄膜的独特微观结构，并将生长条件与观察到的微观结构缺陷联系起来。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Increased thermal conductivity polycrystalline diamond for low-dissipation micromechanical resonators

This paper reports an investigation of microcrystalline diamond (MCD) films deposited under different conditions to increase thermal conductivity and therefore mechanical quality factor (Q) in micromechanical resonators. Through a study of different deposition conditions, we demonstrate a three-fold increase in thermal conductivity and quality factor. Quality factor measurements were conducted on double ended tuning fork resonators, showing Q = 241,047 at fn = 246.86 kHz after annealing, the highest Q reported for polycrystalline diamond resonators. We further present a study of the unique microstructure of hot filament chemical vapor deposition (HFCVD) diamond films and relate growth conditions to observed microstructural defects.

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来源期刊

2014 IEEE 27th International Conference on Micro Electro Mechanical Systems (MEMS)

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