S. Hidalgo, J. Fernandez, P. Godignon, J. Rebollo, J. Millán
{"title":"功率横向DMOS晶体管测试结构","authors":"S. Hidalgo, J. Fernandez, P. Godignon, J. Rebollo, J. Millán","doi":"10.1109/ICMTS.1993.292897","DOIUrl":null,"url":null,"abstract":"The design and the fabrication of LDMOS test structures are discussed. The impact of cell dimensions and epilayer properties on the device characteristics is shown, together with the optimization of V/sub BR//R/sub ON/ trade-off. The influence of device layout, edge device termination and geometrical dimensions are investigated with these test structures. Square, circular, single-finger, multi-finger, and waved gate layouts are considered in the test monitor chip. The fabrication process is a conventional poly-gate double diffusion MOS (DMOS) process based on a double diffusion for the active channel formation. The resurfed LDMOS physical behavior is analyzed by means of 2D simulations. The results obtained are compared with experimental data.<<ETX>>","PeriodicalId":123048,"journal":{"name":"ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures","volume":"99 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-03-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Power lateral DMOS transistor test structures\",\"authors\":\"S. Hidalgo, J. Fernandez, P. Godignon, J. Rebollo, J. Millán\",\"doi\":\"10.1109/ICMTS.1993.292897\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The design and the fabrication of LDMOS test structures are discussed. The impact of cell dimensions and epilayer properties on the device characteristics is shown, together with the optimization of V/sub BR//R/sub ON/ trade-off. The influence of device layout, edge device termination and geometrical dimensions are investigated with these test structures. Square, circular, single-finger, multi-finger, and waved gate layouts are considered in the test monitor chip. The fabrication process is a conventional poly-gate double diffusion MOS (DMOS) process based on a double diffusion for the active channel formation. The resurfed LDMOS physical behavior is analyzed by means of 2D simulations. The results obtained are compared with experimental data.<<ETX>>\",\"PeriodicalId\":123048,\"journal\":{\"name\":\"ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures\",\"volume\":\"99 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-03-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICMTS.1993.292897\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"ICMTS 93 Proceedings of the 1993 International Conference on Microelectronic Test Structures","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMTS.1993.292897","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
摘要
讨论了LDMOS测试结构的设计和制作。研究了电池尺寸和脱膜性能对器件特性的影响,并对V/sub / BR//R/sub on /权衡进行了优化。利用这些试验结构,研究了器件布局、边缘器件端接和几何尺寸对实验结果的影响。在测试监控芯片中考虑了方形、圆形、单指、多指和波形门的布局。制造工艺是基于双扩散形成有源沟道的传统多栅极双扩散MOS (DMOS)工艺。采用二维仿真的方法分析了填充后的LDMOS的物理行为。所得结果与实验数据进行了比较。
The design and the fabrication of LDMOS test structures are discussed. The impact of cell dimensions and epilayer properties on the device characteristics is shown, together with the optimization of V/sub BR//R/sub ON/ trade-off. The influence of device layout, edge device termination and geometrical dimensions are investigated with these test structures. Square, circular, single-finger, multi-finger, and waved gate layouts are considered in the test monitor chip. The fabrication process is a conventional poly-gate double diffusion MOS (DMOS) process based on a double diffusion for the active channel formation. The resurfed LDMOS physical behavior is analyzed by means of 2D simulations. The results obtained are compared with experimental data.<>