用于封装故障隔离的动态数字调制热测量

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2016-07-18 DOI:10.1109/IPFA.2016.7564236

A. Mohan, W. Qiu, Bernice Zee, R. A. Falk, Tram Pham

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引用次数: 0

摘要

本文介绍了动态数字调制(DDM)技术在倒装芯片和堆叠封装缺陷深度无损估计中的应用。利用DDM技术分析了不同缺陷深度器件的热响应，利用热信号提取的热上升时间数据解释了缺陷深度，并用物理失效分析(Physical Failure Analysis, PFA)进行了验证。

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Dynamic digital modulation thermal measurement for package fault isolation

This paper describes the use of Dynamic Digital Modulation (DDM) technique for the non-destructive estimation of defect depth in flip chip and stack die packages. The thermal responses of various devices with different defect depths are analyzed using the DDM technique and the thermal rise time data extracted from the thermal signal are used to interpret the defect depth which are validated with Physical Failure Analysis (PFA).

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2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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