{"title":"世界银行集团电力电子一体化发展的机遇与挑战","authors":"A. Castellazzi","doi":"10.1109/3D-PEIM49630.2021.9497265","DOIUrl":null,"url":null,"abstract":"Wide-band-gap semiconductors offer ample scope for progress beyond state-of-the-art in the key parameters of power electronics technology evolution: efficiency, power density and reliability. In particular, their capability for higher switching speeds, higher switching frequencies and operating temperatures has been demonstrated to yield important benefits at system level, even when transistors are used as a drop-in replacement of Si ones. Still, full exploitation of the superior features of wide-band-gap devices and their subsequent large volume deployment is conditional to the bespoke development of auxiliary technology and solutions, including cooling and packaging, as well as design tools and validation methodologies. This papers reviews some of the progress made over the past few years and discusses future needs to ensure successful large-scale application.","PeriodicalId":352038,"journal":{"name":"2021 Third International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Opportunities and challenges of integrated WBG power electronics development\",\"authors\":\"A. Castellazzi\",\"doi\":\"10.1109/3D-PEIM49630.2021.9497265\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Wide-band-gap semiconductors offer ample scope for progress beyond state-of-the-art in the key parameters of power electronics technology evolution: efficiency, power density and reliability. In particular, their capability for higher switching speeds, higher switching frequencies and operating temperatures has been demonstrated to yield important benefits at system level, even when transistors are used as a drop-in replacement of Si ones. Still, full exploitation of the superior features of wide-band-gap devices and their subsequent large volume deployment is conditional to the bespoke development of auxiliary technology and solutions, including cooling and packaging, as well as design tools and validation methodologies. This papers reviews some of the progress made over the past few years and discusses future needs to ensure successful large-scale application.\",\"PeriodicalId\":352038,\"journal\":{\"name\":\"2021 Third International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-06-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 Third International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/3D-PEIM49630.2021.9497265\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 Third International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/3D-PEIM49630.2021.9497265","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Opportunities and challenges of integrated WBG power electronics development
Wide-band-gap semiconductors offer ample scope for progress beyond state-of-the-art in the key parameters of power electronics technology evolution: efficiency, power density and reliability. In particular, their capability for higher switching speeds, higher switching frequencies and operating temperatures has been demonstrated to yield important benefits at system level, even when transistors are used as a drop-in replacement of Si ones. Still, full exploitation of the superior features of wide-band-gap devices and their subsequent large volume deployment is conditional to the bespoke development of auxiliary technology and solutions, including cooling and packaging, as well as design tools and validation methodologies. This papers reviews some of the progress made over the past few years and discusses future needs to ensure successful large-scale application.