{"title":"产量方法-三阶段法","authors":"T. Pouedras, M. Ben-tzur","doi":"10.1109/ASMC.1999.798171","DOIUrl":null,"url":null,"abstract":"A novel yield methodology approach is developed. This methodology is applicable to each of the three phases from technology development to manufacturing. This methodology highlights the goals for each phase and describes all the procedures needed for optimizing the learning rate and reducing the cycle time between technology development and manufacturing.","PeriodicalId":424267,"journal":{"name":"10th Annual IEEE/SEMI. Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings (Cat. No.99CH36295)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-09-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Yield methodology-three phases approach\",\"authors\":\"T. Pouedras, M. Ben-tzur\",\"doi\":\"10.1109/ASMC.1999.798171\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A novel yield methodology approach is developed. This methodology is applicable to each of the three phases from technology development to manufacturing. This methodology highlights the goals for each phase and describes all the procedures needed for optimizing the learning rate and reducing the cycle time between technology development and manufacturing.\",\"PeriodicalId\":424267,\"journal\":{\"name\":\"10th Annual IEEE/SEMI. Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings (Cat. No.99CH36295)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1999-09-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"10th Annual IEEE/SEMI. Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings (Cat. No.99CH36295)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC.1999.798171\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"10th Annual IEEE/SEMI. Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings (Cat. No.99CH36295)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.1999.798171","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A novel yield methodology approach is developed. This methodology is applicable to each of the three phases from technology development to manufacturing. This methodology highlights the goals for each phase and describes all the procedures needed for optimizing the learning rate and reducing the cycle time between technology development and manufacturing.