Michael Haase, Nils Dittmar, M. Küchler, Danny Reuter
{"title":"一个简单的分析模型来描述等离子体物质的时间分辨浓度","authors":"Michael Haase, Nils Dittmar, M. Küchler, Danny Reuter","doi":"10.1109/IITC/MAM57687.2023.10154646","DOIUrl":null,"url":null,"abstract":"Based on the observations of the time behavior of the etching product SiF4, an analytical model was derived. Based on the physical quantities in the model equation, the production rate and the suppression rate are introduced, which can be used to describe the process.","PeriodicalId":241835,"journal":{"name":"2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A simple analytical model to describe time-resolved concentrations of plasma species\",\"authors\":\"Michael Haase, Nils Dittmar, M. Küchler, Danny Reuter\",\"doi\":\"10.1109/IITC/MAM57687.2023.10154646\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Based on the observations of the time behavior of the etching product SiF4, an analytical model was derived. Based on the physical quantities in the model equation, the production rate and the suppression rate are introduced, which can be used to describe the process.\",\"PeriodicalId\":241835,\"journal\":{\"name\":\"2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2023-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC/MAM57687.2023.10154646\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC/MAM57687.2023.10154646","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A simple analytical model to describe time-resolved concentrations of plasma species
Based on the observations of the time behavior of the etching product SiF4, an analytical model was derived. Based on the physical quantities in the model equation, the production rate and the suppression rate are introduced, which can be used to describe the process.