B. Suparjo, Jugantor Chetia, Ankit Shah
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引用次数: 0

摘要

分层集成扫描为测试大型定制ASIC设计提供了许多好处。然而,在全芯片级的物理实现变得非常具有挑战性,因为块的数量和层次结构的水平增加。此外,在多个层次结构中维护时间约束可能非常耗费资源。本文提出了一种利用全芯片扫描架构创新来克服这些挑战的新框架。我们的数据显示,在没有任何设计质量损失的情况下,框架在测试覆盖率和设计收敛时间方面提供了显著的改进,从而节省了成本并加快了上市时间。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Seamless Physical Implementation of ASIC Hierarchical Integrated Scan Architecture
Hierarchical integrated scan provides many benefits for testing large custom ASIC designs. Physical implementation at full chip level however becomes very challenging as the number of blocks and the levels of hierarchy increase. Additionally, maintaining timing constraints at multiple levels of hierarchy can be very resource intensive. This paper presents a novel framework to overcome these challenges using full chip scan architectural innovation. Our data shows that framework provides significant improvements in terms of test coverage and design convergence time without any design quality loss, thus generating cost saving and accelerating time-to-market.
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