{"title":"0.1 /spl μ m CMOS的器件和技术挑战","authors":"S.S. Wong","doi":"10.1109/HKEDM.1997.641997","DOIUrl":null,"url":null,"abstract":"Summary form only given. The integrated circuit industry is poised to introduce 0.25 /spl mu/m products before the end of this year, and is projected to deliver 0.1 /spl mu/M process in less than 10 years. We will review the challenges ahead and focus on the research opportunities in device and process technology.","PeriodicalId":262767,"journal":{"name":"1997 IEEE Hong Kong Proceedings Electron Devices Meeting","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-08-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Device and technology challenges for 0.1 /spl mu/m CMOS\",\"authors\":\"S.S. Wong\",\"doi\":\"10.1109/HKEDM.1997.641997\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Summary form only given. The integrated circuit industry is poised to introduce 0.25 /spl mu/m products before the end of this year, and is projected to deliver 0.1 /spl mu/M process in less than 10 years. We will review the challenges ahead and focus on the research opportunities in device and process technology.\",\"PeriodicalId\":262767,\"journal\":{\"name\":\"1997 IEEE Hong Kong Proceedings Electron Devices Meeting\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1997-08-30\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1997 IEEE Hong Kong Proceedings Electron Devices Meeting\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/HKEDM.1997.641997\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 IEEE Hong Kong Proceedings Electron Devices Meeting","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HKEDM.1997.641997","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Device and technology challenges for 0.1 /spl mu/m CMOS
Summary form only given. The integrated circuit industry is poised to introduce 0.25 /spl mu/m products before the end of this year, and is projected to deliver 0.1 /spl mu/M process in less than 10 years. We will review the challenges ahead and focus on the research opportunities in device and process technology.