快速准确的半导体晶圆缺陷簇自动提取

2010 Fifth IEEE International Symposium on Electronic Design, Test & Applications Pub Date : 2010-01-13 DOI:10.1109/DELTA.2010.66

M. Ooi, Chris Chan, W. J. Tee, Y. Kuang, L. Kleeman, S. Demidenko

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引用次数: 4

摘要

集成电路(IC)半技术的减少，传统的故障隔离和故障分析技术将不再可持续。目前迫切需要一种诊断软件工具，可以将从制造缺陷中观察到的(表现为集群)追溯到特定的过程、设备或技术，一种新的数据挖掘算法，从测试数据日志中发现缺陷。该算法提供了99%的检测准确率。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Fast and Accurate Automatic Defect CLuster Extraction for Semiconductor Wafers

Reduction in integrated circuit (IC) half technology, which will no longer be sustainable by traditional fault isolation and failure analysis techniques. There is an urgent need for diagnostic software tools with (which manifest as clusters) observed from manufacturing defects can be traced back to a specific process, equipment or technology, a novel data mining algorithm defects from test data logs. This algorithm and provides accurate detection of 99%.

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来源期刊

2010 Fifth IEEE International Symposium on Electronic Design, Test & Applications

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