生产晶圆探测过程的实时现场监测与表征

Proceedings International Test Conference 1997 Pub Date : 1997-11-01 DOI:10.1109/TEST.1997.639694

Minh Quach, K. Harper

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引用次数: 1

摘要

本文介绍了一种能够实时监控和表征生产晶圆探测过程的新技术。利用这种新技术，从生产晶圆上采集的探测接触电阻数据与晶圆产量相关。数据表明，生产晶片比金属化晶片更适合于表征探测接触电阻。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Real time in-situ monitoring and characterization of production wafer probing process

This paper introduces a new technique that enables real-time monitoring and characterization of a production wafer probing process. Using this new technique, probing contact resistance data taken from production wafers has been correlated with wafer yield. Data are presented showing that production wafers are better suited for characterizing probing contact resistance than metalized setup wafers.

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Proceedings International Test Conference 1997

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