低于100微米间距的模板印刷

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) Pub Date : 2004-12-08 DOI:10.1109/EPTC.2004.1396633

Marc P. Y. Desmulliez, Robert W. Kay, S. Stoyanov, Chris Bailey

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引用次数: 5

摘要

本文介绍了最新的印刷结果在小于100微米间距在模板印刷类型6和7无铅焊锡膏和导电胶。介绍了微工程模板的优点，并与其他焊接技术进行了比较。介绍了打印沉积物的特征，并对模板打印的未来应用进行了描述。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Stencil printing at sub-100 microns pitch

This article presents the latest print results at less than 100 microns pitch obtained in stencil printing type 6 and 7 lead-free solder pastes and conductive adhesives. The advantages of the microengineered stencil arc presented and compared with other bonding technologies. Characterisation of the print deposits is presented and future applications of stencil printing are described.

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来源期刊

Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971)

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