CostAS-KGD process cost modeling

Multi-Chip Module (MCM) technologies offer a wide variety of design options for the integration of electronics. However, a number of optimization problems have been reported in literature for the production of such highly complex circuits. One of the most well known problems is the dependence of module yield on the availability of so called Known-Good-Dies (KGDs). Hence, uncertainties about the quality level of the unpackaged (bare) dies available to the MCM manufacturer pose a number of questions concerning test, rework and die handling strategies. The cost and goodness methodologies introduced in this paper facilitate a thorough analysis and optimization of different possible MCM production flows. Moreover, the results generated demonstrate the power of the approach introduced.