基于Cu on聚酰亚胺基板的聚合物微加工及其在柔性MEMS传感器中的应用

Yosuke Niimi, S. Shibata, M. Shikida
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引用次数: 9

摘要

作为制造各种柔性MEMS传感器的一种方法,我们开发了一种工艺,该工艺使用Cu On poly亚胺(COP)衬底作为起始材料,并牺牲Cu蚀刻以在衬底上产生腔和电馈通结构。研究了氯化铁溶液中Cu的刻蚀特性,结果表明,深度和侧边方向的刻蚀与掩膜图案和刻蚀时间密切相关。在得到刻蚀结果的基础上,设计了一种带状柔性热传感器。设计了一个加热器和两个温度传感器用于流量和加速度传感器的应用。在聚酰亚胺薄膜上成功地制备了传感金属,并在COP衬底上成功地制备了馈通电路。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Polymer micromachining based on Cu On Polyimide substrate and its application to flexible MEMS sensor
As a way of making a variety of flexible MEMS sensors, we developed a process that uses a Cu On Polyimide (COP) substrate as a starting material and sacrificial Cu etching to produce a cavity and electrical feed-through structures on the substrate. The Cu etching characteristics of an iron (II) chloride solution were studied, and the results confirmed that etching in the depth and side directions strongly depended on the mask pattern and the etching time. A strip-shaped flexible thermal sensor was designed on the basis of the obtained etching results. One heater and two temperature sensors were designed for flow and acceleration sensors applications. The sensing metal on the polyimide thin membrane and the feed-through were successfully fabricated on the COP substrate.
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