交叉检查- ASIC可测试性的实用解决方案

G. Swan, Y. Trivedi, D. J. Wharton
{"title":"交叉检查- ASIC可测试性的实用解决方案","authors":"G. Swan, Y. Trivedi, D. J. Wharton","doi":"10.1109/TEST.1989.82381","DOIUrl":null,"url":null,"abstract":"It is noted that testing ASICs (application-specific integrated circuits) has become a significant problem for engineers; manual generation of test patterns is too time consuming, and automatic generation of test patterns is very difficult, if not impossible, without imposing significant overheads on the design. It is shown that this challenge can be addressed by an innovative solution called CrossCheck. The CrossCheck method fundamentally solves the problem by using a combination of software and hardware techniques. The hardware portion of the technology involves modifying the base array of an ASIC such that it contains a structure similar to a bed of nails. This embedded probe structure provides massive observability within the design, which in turn makes it inherently testable. The software can then take advantage of this testability by providing a set of high-performance tools (typically 40 times faster) which will fault simulate/test generate a broad range of manufacturing defects, including transistor opens and shorts or net opens and shorts. The authors give an overview of the technology and then describe probable defects which may occur in CMOS. They conclude that adoption of CrossCheck allows unprecedented levels of fault coverage and chip or board diagnosis to be achieved.<<ETX>>","PeriodicalId":264111,"journal":{"name":"Proceedings. 'Meeting the Tests of Time'., International Test Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1989-08-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"12","resultStr":"{\"title\":\"CrossCheck-a practical solution for ASIC testability\",\"authors\":\"G. Swan, Y. Trivedi, D. J. Wharton\",\"doi\":\"10.1109/TEST.1989.82381\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"It is noted that testing ASICs (application-specific integrated circuits) has become a significant problem for engineers; manual generation of test patterns is too time consuming, and automatic generation of test patterns is very difficult, if not impossible, without imposing significant overheads on the design. It is shown that this challenge can be addressed by an innovative solution called CrossCheck. The CrossCheck method fundamentally solves the problem by using a combination of software and hardware techniques. The hardware portion of the technology involves modifying the base array of an ASIC such that it contains a structure similar to a bed of nails. This embedded probe structure provides massive observability within the design, which in turn makes it inherently testable. The software can then take advantage of this testability by providing a set of high-performance tools (typically 40 times faster) which will fault simulate/test generate a broad range of manufacturing defects, including transistor opens and shorts or net opens and shorts. The authors give an overview of the technology and then describe probable defects which may occur in CMOS. They conclude that adoption of CrossCheck allows unprecedented levels of fault coverage and chip or board diagnosis to be achieved.<<ETX>>\",\"PeriodicalId\":264111,\"journal\":{\"name\":\"Proceedings. 'Meeting the Tests of Time'., International Test Conference\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1989-08-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"12\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings. 'Meeting the Tests of Time'., International Test Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TEST.1989.82381\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. 'Meeting the Tests of Time'., International Test Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TEST.1989.82381","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 12

摘要

值得注意的是,测试asic(专用集成电路)已经成为工程师的一个重要问题;手动生成测试模式非常耗时,而自动生成测试模式即使不是不可能的,也是非常困难的,否则会给设计带来很大的开销。研究表明,这一挑战可以通过一种名为CrossCheck的创新解决方案来解决。CrossCheck方法通过软硬件技术的结合,从根本上解决了这一问题。该技术的硬件部分涉及修改ASIC的基本阵列,使其包含类似于钉床的结构。这种嵌入式探针结构在设计中提供了大量的可观察性,这反过来又使其具有固有的可测试性。然后,软件可以通过提供一组高性能工具(通常速度快40倍)来利用这种可测试性,这些工具将故障模拟/测试产生广泛的制造缺陷,包括晶体管开路和短路或净开路和短路。作者给出了该技术的概述,然后描述了CMOS中可能出现的缺陷。他们的结论是,采用CrossCheck可以实现前所未有的故障覆盖率和芯片或板诊断。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
CrossCheck-a practical solution for ASIC testability
It is noted that testing ASICs (application-specific integrated circuits) has become a significant problem for engineers; manual generation of test patterns is too time consuming, and automatic generation of test patterns is very difficult, if not impossible, without imposing significant overheads on the design. It is shown that this challenge can be addressed by an innovative solution called CrossCheck. The CrossCheck method fundamentally solves the problem by using a combination of software and hardware techniques. The hardware portion of the technology involves modifying the base array of an ASIC such that it contains a structure similar to a bed of nails. This embedded probe structure provides massive observability within the design, which in turn makes it inherently testable. The software can then take advantage of this testability by providing a set of high-performance tools (typically 40 times faster) which will fault simulate/test generate a broad range of manufacturing defects, including transistor opens and shorts or net opens and shorts. The authors give an overview of the technology and then describe probable defects which may occur in CMOS. They conclude that adoption of CrossCheck allows unprecedented levels of fault coverage and chip or board diagnosis to be achieved.<>
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