校准硅迁移率和不完全电离模型与场依赖电离能的低温模拟

H. Wong
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引用次数: 11

摘要

工作在77K和4.2K之间的低温硅CMOS在高速服务器应用和量子计算机外围越来越受欢迎。在低温条件下,掺杂不完全电离和场增强电离成为主要的物理现象。因此,在低温TCAD模拟中使用精确且校准良好的迁移率和不完全电离模型是很重要的。在本文中,我们提出了Philips统一迁移模型(PhuMob)和Altermatt的不完全电离模型,该模型在300K和20K之间校准,用于硅中硼和砷掺杂剂的掺杂浓度跨越5个数量级。提出了一种将场相关电离能纳入Altermatt模型的新方法,即使在4K的3D TCAD模拟中也能取得良好的收敛性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Calibrated Si Mobility and Incomplete Ionization Models with Field Dependent Ionization Energy for Cryogenic Simulations
Cryogenic silicon CMOS operating between 77K and 4.2K is becoming more popular in high-speed server applications and the periphery of quantum computers. In the cryogenic regime, dopant incomplete ionization and field enhanced ionization become dominating physical phenomena. Therefore, it is important to use accurate and well-calibrated mobility and incomplete ionization models in cryogenic TCAD simulations. In this paper, we present a Philips Unified Mobility Model (PhuMob) and Altermatt’s incomplete ionization model calibrated between 300K and 20K for boron and arsenic dopants in silicon across 5 orders of magnitude in doping concentration. A novel method is proposed to include field-dependent ionization energy in Altermatt’s model, which results in good convergence even in 3D TCAD simulations at 4K.
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