混合硅激光器:利用晶圆键合集成III-V和硅光子学

2010 IEEE International SOI Conference (SOI) Pub Date : 2010-11-18 DOI:10.1109/SOI.2010.5641405

R. Jones, H. Park, A. Fang, M. Sysak, B. Koch, D. Liang, H. Chang, J. Bowers

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引用次数: 3

摘要

本讲座将概述混合硅激光器件平台，该平台将InP与SOI异质集成以制造集成激光器的硅光子芯片。将讨论与这种集成相关的挑战，以及将混合硅激光器与其他硅光子元件集成在实现太比特硅光子链路的道路上的例子。

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Hybrid silicon lasers: Integration of III–V and silicon photonics using wafer bonding

This talk will give an overview of the hybrid silicon laser device platform which heterogeneously integrates InP with SOI to fabricate silicon photonic chips with integrated lasers. Challenges associated with this integration will be discussed as well as examples of integrating hybrid silicon lasers with other silicon photonic components on the path to achieving a terabit silicon photonic link.

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2010 IEEE International SOI Conference (SOI)

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