肖特基源技术实现高击穿电压InAlN/AlN/GaN hemt

Qi Zhou, Wanjun Chen, Sheng-gen Liu, Bo Zhang, Zhihong Feng, S. Cai, K. J. Chen
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引用次数: 4

摘要

在本文中,我们证明了使用一种新的肖特基源技术将晶格匹配In0.17Al0.83N/GaN高电子迁移率晶体管(HEMTs)的失态击穿电压(BV)提高了253%。基于这一概念,提出了肖特基源(SS) InAlN/GaN hemt。LGD为15 μm的SS hemt的三端BV为650 V,而相同几何形状的常规InAlN/GaN hemt的最大BV为184 V。在不使用任何场极板的情况下,在所提出的器件中测量的结果是在InAlN/GaN hemt上实现的最高BV。相应的比导通电阻(Rsp, on)低至3.4 mΩ·cm2。在LGD=1 μm的SS InAlN/GaN hemt中获得了118v的BV,这是具有如此短LGD的GaN基hemt中最高的BV。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High breakdown voltage InAlN/AlN/GaN HEMTs achieved by Schottky-Source technology
In this paper, we demonstrate 253% improvement in the off-state breakdown voltage (BV) of the lattice-matched In0.17Al0.83N/GaN high-electron-mobility transistors (HEMTs) by using a new Schottky-Source technology. Based on this concept, the Schottky-Source (SS) InAlN/GaN HEMTs are proposed. The SS HEMTs with a LGD of 15 μm showed a three-terminal BV of 650 V, while conventional InAlN/GaN HEMTs of the same geometry showed a maximum BV of 184 V. Without using any field-plate the result measured in the proposed device is the highest BV ever achieved on InAlN/GaN HEMTs. The corresponding specific on-resistance (Rsp, on) is as low as 3.4 mΩ·cm2. A BV of 118 V was also obtained in an SS InAlN/GaN HEMTs with LGD=1 μm, which is the highest BV in GaN-based HEMTs featuring such a short LGD with GaN buffer.
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