FMEA/PFMEA:正规学校从来没有教你的东西

S. Shridhar
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引用次数: 0

摘要

FMEA或失效模式影响分析是一种分析程序,用于识别和最小化产品和工艺设计中的风险因素。虽然FMEA方法自20世纪40年代以来一直在使用,但该程序的有效性在20世纪70年代后期被汽车行业采用后变得非常普遍。FMEA程序是一种预防性工具,因此必须在产品设计和制造或服务过程完成之前执行。质量保证标准,如ISO 9001和TS 16949强调在产品和过程设计中需要最小化和/或消除风险,这导致许多组织采用FMEA方法作为其研发过程的一部分。这种广泛使用是令人鼓舞的,但同样重要的是正确使用程序,否则所产生的文件将无法提供检测风险所需的重点。使用鲁棒性工具,如边界图、参数图和界面矩阵,是必要的,以便在检测风险因素时引入所需的纪律。经验表明,工程师通常只关注他们直接控制的那些方面,而忽略了因果因素,特别是系统中的接口,客户对产品的误用-无论是有意还是无意的,以及自然退化,所有这些都会导致风险。在本文中,作者解释了健壮性工具如何有效地应用于半导体封装等产品的设计和制造设计。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
FMEA/PFMEA : What they never teach you in formal school
FMEA or Failure Mode Effects Analysis is an analytical procedure to identify and minimize risk factors in product and process designs. Whilst the FMEA methodology has been in use since the 1940's, the effectiveness of the procedure became really widespread after its adoption by the automotive industry in the late 1970's. The FMEA procedure is a preventative tool and hence must be performed prior to finalization of the design of the product and the manufacturing or service processes. Quality Assurance Standards such as ISO 9001 and TS 16949 emphasize the need for minimizing and /or eliminating risks in the design of products and processes, which has led to many organisations adopting the FMEA methodology as part of their D & D processes. This widespread use is encouraging, but equally important is the correct use of the procedure as otherwise the resultant documentation will not provide the required focus in the detection of risks. The use of robustness tools such as the Boundary diagram, Parameter diagram and the Interface matrix is essential in order to bring in the required discipline in the detection of risk factors. Experience shows that engineers often focus only on those aspects that they control directly and miss the causal factors, particularly the interfaces in the system, misuse of the product by the customer - either intentional or unintentional, and natural degradation, all of which cause the risks. In this article, the author explains how the robustness tools can be usefully applied in both the design and manufacturing design of products such as semiconductor packaging.
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